Silicon pressure chip without isolation diaphragm — Series 1TAB

Description

The TAB 1 sensor series is designed for measuring absolute pressure. Two versions are available. Version 1 must be soldered onto a substrate and placed in an oil-filled housing to create an industrial sensor. Version 2 can be soldered directly onto a printed circuit board, allowing measurement of level or ambient pressure.

TAB (Tape Automated Bonding) is a special process for connecting diffused resistors on a silicon chip. Aluminum contacts are connected to gold rounded contacts with a diameter of 0.1 mm. The tinned ends of copper strips are soldered to these gold contacts. Each contact can withstand a force of more than 1 Newton. TAB sensors endure extreme vibration and shock loads. TAB sensors can
be placed in a high-viscosity gel or molded product (for measuring water level) without risk of contact damage, unlike chips with conventional separately welded contacts.

Note: to ensure the sensor is within the specified temperature error, the sensor must be tested. It may be necessary to add a compensation resistor.